Grounds and Envelopes: Reshaping Architecture and the Built Environment, 1st Edition eBook

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Providing a source of vision for the revitalisation of ground and envelope as spatial elements that can inform the search for embedded locally specific architectures, this book collects essays and projects that each contributes a particular element to what might constitute an integrated and richly nuanced approach to spatial organisation. Projects include: Paulo Mendes da Rocha; Brazilian Pavilion, Osaka World Expo 1970, Osaka, Japan RCR Arquitectes: Marquee at Les Cols Restaurant, Olot, Girona, Spain Weiss / Manfredi; Seattle Art Museum: Olympic Sculpture Park, Seattle, Washington, USA Peter Eisenman; City of Culture of Galicia, Santiago de Compostela, Spain Plasma Studio and Groundlab; Xi’an Horticultural Expo, Longgang, China Foreign Office Architects; Yokohama International Ferry Terminal, Yokohama, Japan Nekton Design; Turf City, Reykjavik, Iceland Alvaro Siza; Swimming Pool, Leça da Palmeira, Portugal Eduardo Souto de Moura; Braga Municipal Stadium, Braga Portugal MVRDV; Villa VPRO, Hilversum, Netherlands Bernard Tschumi; Le Fresnoy Art Centre, Tourcoing, France OCEAN; World Centre for Human Concerns, New York City, USA R&Sie(n); Spidernethewood, Nîmes, France Toyo Ito; Serpentine Pavilion, London, England Enric Miralles and Carme Pinós; Olympic Archery Range, Barcelona, Spain Kengo Kuma; GC Prostho Museum Research Centre, Aichi Prefecture, Japan Cloud 9; MediaTic, Barcelona, Spain Diller, Scofidio and Renfro; Blur Building, Yverdon-les-Bains, Switzerland, Swiss National Expo With an abundance of built and un-built key projects available, it is now possible to outline the contours of a new discourse. This book initiates a new beginning in this direction so that architecture can partake in the creation of heterogeneous space and culturally, socially and environmentally sustainable built environments.

This is a digital product.

Grounds and Envelopes: Reshaping Architecture and the Built Environment 1st Edition is written by Michael U. Hensel; Jeffrey P. Turko and published by Routledge. The Digital and eTextbook ISBNs for Grounds and Envelopes are 9781317541943, 1317541944 and the print ISBNs are 9780415639170, 0415639174. Additional ISBNs for this eTextbook include 9780415639163, 9781315728117, 9781317541950, 9781317541936.